Tokyo Pack
From 14 to 16 October 2026
Tokyo, Japan
Packaging - technology & science
Packaging - technology & science
International exhibition on technologies for bakery, confectionery, machinery for the ice cream and chocolate industry
International Food Exhibition in Paris.
The World of Packaging Technology
Large suppliers of the food industry present innovative solutions
Südback is one of the most important trend trade fairs for the bakery and confectionery trade in Germany and is in great demand.
Northern Europe’s food technology expo and a meeting place for the entire industry
Cibus Tec: Inspiring Innovation in Food and Beverage Technologies.